Antimicrobial bandage with nanostructures

ABSTRACT

The subject disclosure is directed to antimicrobial bandages with nanostructures, formation thereof, and usage thereof to facilitate wound healing. In one embodiment, a bandage apparatus that facilitates healing a wound is provided. The bandage apparatus comprises a substrate comprising an attachment mechanism that facilitates removably attaching the substrate to a part of a body comprising the wound. The bandage apparatus further comprises a nanostructure film provided on a surface of the substrate and configured to contact the wound when the substrate is attached to the part of the body comprising the wound, wherein the nanostructure film comprises a plurality of nanostructures.

TECHNICAL FIELD

This application generally relates to antimicrobial bandages withnanostructures, formation thereof, and usage thereof to facilitate woundhealing.

SUMMARY

The following presents a summary to provide a basic understanding of oneor more embodiments of the invention. This summary is not intended toidentify key or critical elements, or delineate any scope of thedifferent embodiments or any scope of the claims. Its sole purpose is topresent concepts in a simplified form as a prelude to the more detaileddescription that is presented later. The subject disclosure relates toantimicrobial bandages with nanostructures, formation thereof, and usagethereof to facilitate wound healing.

According to an embodiment, bandage apparatus is provided. The bandageapparatus can facilitate healing a wound. The bandage apparatus cancomprise a substrate comprising an attachment mechanism that facilitatesremovably attaching the substrate to a part of a body comprising thewound. The bandage apparatus can further comprise a nanostructure filmprovided on a surface of the substrate and configured to contact thewound when the substrate is attached to the part of the body comprisingthe wound, wherein the nanostructure film comprises a plurality ofnanostructures. In various implementations, respective nanostructures ofthe plurality nanostructures comprise a nanospike geometry.

The physical structure of the nanostructures can be specificallytailored to facilitate mechanically puncturing and killing bacterialcells that grow on and/or around the wound. In this regard, therespective nanostructures of the plurality of nanostructures cancomprise a proximal end on the surface of the substrate and a distal endthat extends away from the proximal end, and wherein the respective nanostructures have a diameter that tapers from the proximal end to thedistal end. In one or more implementations, the distal end can have afirst diameter between about 1.0 nanometer (nm) and about 200 nm. Theproximal can have a second diameter between about 1.0 nm to about 1.0micrometer (μm). The respective nanostructures can also have a heightbetween about 100 nm and about 10.0 μm. The spacing or pitch between therespective nanostructures can further be between about 100 nm and about2.0 μm.

In various implementations, the substrate and the nanostructure film cancomprise a flexible material. In this regard, the nanostructure film andthe nanostructures can be formed with a material that is rigid enough topuncture bacterial cells but flexible enough to bend over and around acurved surface of the body to which it is attached without breaking. Inone or more implementations, the nanostructure film and nanostructurescan comprise a polymer material.

In another embodiment, a method is provided. The method can be a methodthat facilitates forming an antimicrobial bandage comprising a pluralityof nanostructures. The method can comprise etching a silicon wafer toform a plurality of silicon nanostructures, and generating ananostructure mold using the silicon nanostructures, the nanostructuremold comprising a plurality of nanostructure pores respectivelycorresponding to the silicon nanostructures. The method can furthercomprise employing the nanostructure mold to generate a nanostructurefilm comprising a plurality of nanostructures respectively correspondingto the nanostructure pores, and adhering the nanostructure film to asurface of a bandage substrate, thereby generating the antibacterialbandage. The bandage substrate can comprise a flexible material that canremovably attach to a part of a body comprising a wound. Thenanostructure film can comprise a flexible polymer material.

In one implementation, the etching of the silicon wafer can compriseemploying metal-assisted chemical etching. In another implementation,the etching can comprise employing laser interference lithography. Thesilicon wafer can be etched to generate the silicon nanostructures witha pitch between about 100 nm and about 2.0 μm and a height between about100 nm and about 10.0 μm. The nanostructure mold can be used to generatethe nanostructure film by applying a polymer material onto thenanostructure mold and filling the nanostructure pores with the polymermaterial, curing the polymer material after the applying, therebygenerating the nanostructure film, and removing the nanostructure filmfrom the nanostructure mold.

In one or more additional embodiments, an antimicrobial bandage isprovided. The antimicrobial bandage can comprise: a substrate comprisingan attachment mechanism that facilitates removably attaching thesubstrate to a part of a body comprising a wound; and nanospikesprovided on a surface of the substrate configured to contact the woundwhen the substrate is attached to the part of the body comprising thewound, wherein the nanospikes have a structure that facilitates reducingbacterial growth associated with the wound, thereby facilitating thehealing of the wound.

BRIEF DESCRIPTION OF THE DRAWINGS

Numerous embodiments, objects and advantages of the present inventionwill be apparent upon consideration of the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich like reference characters refer to like parts throughout, and inwhich:

FIG. 1 presents an example antimicrobial bandage apparatus comprising ananostructure layer in accordance with various embodiments describedherein.

FIG. 2 presents an enlarged view of a portion of the nanostructure layerof an antimicrobial bandage apparatus in accordance with variousembodiments described herein.

FIG. 3 presents another example antimicrobial bandage apparatuscomprising a nanostructure layer in accordance with various embodimentsdescribed herein.

FIG. 4 presents a three-dimensional view of an example nanostructurelayer of an antimicrobial bandage apparatus in accordance with variousembodiments described herein.

FIG. 5A presents a microscopic view of an example nanostructure layer inaccordance with various embodiments described herein.

FIG. 5B presents another microscopic view of the example nanostructurelayer yet having rupture bacterial membrane formed thereon in accordancewith various embodiments described herein.

FIGS. 6A and 6B provide graphical illustrations demonstratingexperimental performance of a nanostructure layer with respect toreducing bacterial growth under static and rotating conditions inaccordance with various embodiments described herein.

FIGS. 7A and 7B provide graphical illustrations demonstratingexperimental performance nanostructures layer with different surfaceareas with respect to reducing bacterial growth in accordance withvarious embodiments described herein.

FIG. 8 provides a visual flow diagram of an example process thatfacilitates fabricating an antimicrobial bandage apparatus comprising ananostructure layer in accordance with various embodiments describedherein.

FIG. 9 provides a flow diagram of an example method that facilitatesgenerating an antimicrobial bandage apparatus comprising a nanostructurelayer in accordance with various embodiments described herein.

FIG. 10 provides a flow diagram of an example method that facilitateswound healing using an antimicrobial bandage apparatus in accordancewith various embodiments described herein.

DETAILED DESCRIPTION

The following detailed description is merely illustrative and is notintended to limit embodiments and/or application or uses of embodiments.Furthermore, there is no intention to be bound by any expressed orimplied information presented in the preceding Summary section or in theDetailed Description section.

The subject disclosure relates to antimicrobial bandages withnanostructures, formation thereof, and usage thereof to facilitate woundhealing by providing an antimicrobial functionality. Reducing bacterialinfection on wounds is crucial for wound healing and patient health. Thedisclosed subject matter provides a new bio-inspired approach forreducing bacterial infection associated with wounds using a bandage thatcomprises a nanostructure layer provided on a surface of the bandagethat contacts the wound. The nanostructure layer can comprise aplurality of nanostructures having a nanospike geometry that extend awayfrom the bandage such that the peaks of the nanospikes contact the woundsite. The nanostructures can provide a mechanical mechanism thatfacilitates reducing bacterial growth on or around the wound. Inparticular, bacteria growing on or near the surface of the wound havebeen found to bind to the nanospikes and continue to grow toward andaround the nanospikes. Once the bacterial membrane has grown to athreshold point on and between the nanospikes, the nanospikes puncturethe bacterial membrane, thereby killing the bacterial cells.

The geometric structure of the nanostructure layer can be specificallytailored to provide the aforementioned mechanical mechanism thatfacilitates killing bacteria. For example, if the spacing or pitchbetween the respective nanostructures is too wide or too narrow, thenanospikes will not puncture the bacterial membrane. Likewise, if thetip or point of the nanostructures is too dull, the nanostructures willnot pierce the bacterial membrane. In this regard, the respectivenanostructures can have a nanospike geometry that tapers from theproximal end (the base of the nanostructure) to the distal end (the peakor tip of the nanostructure). In one or more implementations, the distalend can have a first diameter between about 1.0 nm and about 200 nm. Theproximal end can have a second diameter between about 1.0 nm to about1.0 μm. The respective nanostructures can also have a height betweenabout 100 nm and about 10.0 μm. The spacing or pitch between therespective nanostructures can further be between about 100 nm and about2.0 μm. Further, the material employed for the nanostructure layer andnanostructures can include a material that is rigid enough to puncturebacterial cells but flexible enough to bend over and around a curvedsurface of the body to which the antimicrobial bandage is attachedwithout breaking. In one or more implementations, the nanostructurelayer and nanostructures can comprise a polymer material.

In one or more embodiments, semiconductor fabrication techniques can beemployed to form the subject nanostructure layers having the geometricstructure described above at low cost. In this regard, a siliconsubstrate or waver can be etched using metal-assisted chemical etchingor laser interference lithography to generate silicon nanostructureshaving the desired geometric structure. The silicon nanostructures canfurther be employed to form a nanostructure mold comprisingnanostructure pores corresponding to the silicon nanostructures. Thisnanostructure mold can further be employed to generate nanostructurelayers comprising nanostructures that correspond to the siliconnanostructures yet formed out of a suitable material, such as a polymer,for their subject application in antimicrobial bandages. The resultingpolymer nanostructure layer can further be attached to a bandage,thereby generating the disclosed antimicrobial bandage. The type ofbandage to which the polymer nanostructure layer is applied can vary.For example, in some implementations, the bandage can comprise anadhesive bandage, a wrap, or the like. The size of the bandage can alsovary.

As described infra, the subject nanospike surfaces have beenexperimentally found to best kill bacteria under static conditions,making them particularly suitable for the subject antimicrobialapplication in bandages. In addition, because the nanostructures areextremely small in size relative to epithelial layers of the body, thenanostructure layer does not puncture or irritate the wound andassociated epithelial layers. One or more embodiments described hereincan kill bacteria provided by the nanostructure bandage layer and remaineffective for extensive periods of time without re-application and arenot susceptible to bacteria developing antibiotic resistance.Accordingly, with the subject antimicrobial bandages, as the wound healsitself, the nanospike surface can constantly kill bacteria or limitbacterial growth, thereby providing constant protection from the wounddeveloping infection.

One or more embodiments are now described with reference to thedrawings, wherein like referenced numerals are used to refer to likeelements throughout. It should be appreciated that the variousstructures depicted in the drawings (e.g., the antimicrobial bandageapparatus, the nanostructure layer, the silicon nanospikes, the mold,etc.) are merely exemplary and are not drawn to scale. In the followingdescription, for purposes of explanation, numerous specific details areset forth in order to provide a more thorough understanding of the oneor more embodiments. It is evident, however, in various cases, that theone or more embodiments can be practiced without these specific details.

Turning now to the drawings, FIG. 1 presents an example antimicrobialbandage apparatus 100 comprising a nanostructure layer 104 in accordancewith various embodiments described herein. In the embodiment shown, theantimicrobial bandage apparatus 100 comprises a bandage substrate 102and a nanostructure layer 104 formed on a surface of the bandagesubstrate 102. The nanostructure layer 104 comprises a plurality ofnanostructures 106 formed thereon that extend away from the surface ofthe bandage substrate 102.

In the embodiment shown, the antimicrobial bandage apparatus 100 isshown relative to a wound 108. The antimicrobial bandage apparatus 100can facilitate wound healing by providing a mechanical mechanism thatfacilitates reducing bacterial growth on or around the wound 108 usingthe nanostructure layer 104. In this regard, the antimicrobial bandageapparatus 100 can be configured for application to a surface of a bodycomprising a wound (e.g., wound 108), such that the nanostructure layer104 is positioned adjacent to the wound. In some embodiments, the tips(or distal ends) of nanostructures 106 can be configured to contact thewound in association with placement of the antimicrobial bandageapparatus 100 over the wound.

The nanostructures 106 of the nanostructure layer 104 can facilitatewound healing by mechanically killing bacteria cells that grow on oraround the wound 108. In particular, bacteria that grows on or aroundthe surface of the wound 108 have been found to latch onto therespective nanostructures 106 and continue to grow around and betweenthe respective nanostructures 106. In this regard, the nanostructureseffectively extract the bacteria membrane as it grows because thebacteria grab onto the tips of the nanostructures 106 and then continueto grow up the side surfaces of the nanostructures 106. At a certainpoint, a threshold is reached and the nanostructures 106 puncture thebacterial membrane, thereby killing the bacteria.

The aforementioned mechanical mechanism that facilitates killingbacterial provided by the nanostructure layer 104 is based in part onthe geometric structure of the nanostructure layer 104. In this regard,the size, structure and spacing of the nanostructures 106 can bespecifically selected to facilitate growth of bacterial on and aroundthe nanostructures in a manner that results in puncturing of thebacterial membrane. For example, if the spacing or pitch between therespective nanostructures 106 is too wide or too narrow, thenanostructures will not puncture the bacterial membrane. Likewise, ifthe tips of the nanostructures are too dull, the nanostructures will notpierce the bacterial membrane.

FIG. 2 presents an enlarged view of the portion of the nanostructurelayer 104 shown in call out box 101 of FIG. 1. With reference to FIGS. 1and 2, in one or more embodiments, the respective nanostructures 106 canhave a nanospike geometry that tapers from the proximal end (the base ofthe nanostructure) to the distal end (the peak or tip of thenanostructure). In this regard, the diameter of the distal end can besmaller than the diameter of the proximal end. In one embodiment, thedistal end can have a first diameter D1 between about 1.0 nm and about200 nm. The proximal end can have a second diameter D2 between about 1.0nm to about 1.0 μm. The respective nanostructures can also have a heightH between about 100 nm and about 10.0 μm. The pitch P between therespective nanostructures can further be between about 100 nm and about2.0 μm. In another embodiment, the distal end can have a first diameterD1 between about 1.0 nm and about 100 nm. The proximal end can have asecond diameter D2 between about 1.0 nm to about 500 nm. The respectivenano structures can also have a height H between about 500 nm and about5.0 μm. The pitch P between the respective nanostructures can further bebetween about 100 nm and about 1.0 μm. Still in yet another embodiment,the distal end can have a first diameter D1 between about 10.0 nm andabout 70 nm. The proximal end can have a second diameter D2 betweenabout 100.0 nm to about 300 nm. The respective nanostructures can alsohave a height H between about 800 nm and about 2.0 μm. The pitch Pbetween the respective nanostructures can further be between about 200nm and about 800 nm.

In the embodiment shown, respective nanostructures can have a peak topeak distance of S1 and a spacing defined by S2. In someimplementations, the peak to peak distance S1 can be the same orsubstantially the same distance as the pitch P. The spacing distance S2between the bases of the respective nanostructures 106 can be betweenabout between about 1.0 nm to about 1.0 μm in one embodiment. In anotherembodiment, S2 can be between about 50 nm to about 800 nm. In anotherembodiment, S2 can be between about 200 nm to about 500 nm. The variousnanostructure dimensions (e.g., dimensions for D1, D2, H, P, S1 and S2)of the nanostructure layer 104 and associated nanostructures 106described herein provide statistical means of suitable dimensions.However, it should be appreciated that in implementation with a bandage,these dimensions can be adapted as appropriate and the subjectnanostructure layer 104 and associated nanostructures 106 are notlimited to the dimensions described above. In some embodiments, thedimensions of the nanostructures 106 and nanostructure layer 104 can betailored to kill different types of bacteria.

The material employed for the nanostructure layer 104 and nanostructures106 can include a material that is rigid enough to puncture bacterialcells but flexible enough to bend over and around a curved surface ofthe body to which the antimicrobial bandage is attached withoutbreaking. In one or more implementations, the nanostructure layer 104and nanostructures can comprise a polymer material. Some suitablematerials for the nanostructure layer 104 and the nanostructures 106 caninclude but are not limited to: maltose, carboxymethylcellulose,amylopectin, poly(methylvinylether/maleic anhydride), sodiumhyaluronate, chondroitin sulphate/dextrin, sodium alginate, andhydroxypropyl cellulose, PET, polyimide, polydimethylsiloxane (PDMS),polystyrene (PS), polyethylene, polyurethane, polycarbonate, carbonnanotubes, nanowires, nanoparticles, acrylic, epoxy, and hydrogel.

The bandage substrate 102 and the mechanism for applying theantimicrobial bandage apparatus 100 to a surface of a body comprising awound 108 can vary. For example, the antimicrobial bandage apparatus 100can be adapted to facilitate healing of wounds of various shapes, sizesand bodily locations. The antimicrobial bandage apparatus 100 canfurther be adapted for application to wounds on humans as well asanimals. In some implementations, the bandage substrate 102 cancomprises a thin flexible layer of material configured to bend or wraparound parts of a body comprising a wound. For example, the bandagesubstrate 102 can comprise a polymer material, a rubber material, afabric, a paper based material and the like. In one or more embodiments,the antimicrobial bandage apparatus 100 can be configured to removablyattach to the surface of a body comprising a wound. In this regard, theantimicrobial bandage apparatus 100 can be configured for application toa wound for a period of time that facilitates healing the wound. Theantimicrobial bandage apparatus 100 can also be removed and replacedwith a new antimicrobial bandage apparatus every N hours (e.g., 24hours, 48 hours, etc.), which can vary depending on the type of woundand location of the wound.

For example, FIG. 3 presents another example antimicrobial bandageapparatus 300 comprising a nanostructure layer in accordance withvarious embodiments described herein. The antimicrobial bandageapparatus 300 can comprise same or similar features and functionalitiesas antimicrobial bandage apparatus 100 with the addition of and adhesivelayer 302. The adhesive layer 302 can be formed on the same surface ofthe bandage substrate comprising the nanostructure layer 104 and formedaround the nanostructure layer 104. The adhesive layer 302 can comprisean adhesive material that facilitates removably attaching theantimicrobial bandage apparatus 300 to the surface of a body comprisinga wound. For example, in the embodiment shown, the antimicrobial bandageapparatus 300 is attached to the upper epithelial layer 304 around thewound via the adhesive layer 302.

FIG. 4 presents a three-dimensional view of an example nanostructurelayer 104 of an antimicrobial bandage apparatus (e.g., antimicrobialbandage apparatus 100, 300 and the like) in accordance with variousembodiments described herein. The nanostructure layer 104 comprises aplurality of nanostructures 106 that extend therefrom and respectivelyhaving a nanospike geometry. In the embodiment shown, the nanostructures106 are arranged in organized and evenly spaced rows and columns. Thedimensions and spacing of the respective nanostructures 106 can becommensurate with that described with reference to FIG. 2. In otherembodiments, the arrangement of the nanostructures 106 can benon-uniform so long as the statistical means of the dimensions andspacing of the respective nanostructures are commensurate with thatdescribed with reference to FIG. 2. In other embodiments, thearrangement of the nanostructures 106 can vary at different locations ofa bandage. In other embodiments, the arrangement of the nanostructures106 can be non-square arrays.

FIGS. 5A and 5B presents microscopic views of an example nanostructurelayer 500 in accordance with various embodiments described herein. Inone or more embodiments, nanostructure layer 500 can include same orsimilar features and functionalities as nanostructure layer 104. In theembodiment shown, the nanostructure layer 500 comprises a plurality ofirregular or non-uniform nanostructures. The material, dimensions andspacing of the respective nanostructures can be commiserate with thatdescribed with reference to FIG. 2. The nanostructure layer 500 can thusbe employed to facilitate reducing bacterial growth associated withwounds when used in antimicrobial bandages as described herein (e.g.,antimicrobial bandage apparatus 100, 300 and the like).

For example, FIG. 5A presents a microscopic view of the examplenanostructure layer 500 without exposure to bacteria. FIG. 5B presentsanother microscopic view of the example nanostructure layer 500 havingbeen exposed to bacteria (e.g., in association with usage in anantimicrobial bandage apparatus 100 that was applied to a wound). In theembodiment shown in FIG. 5B, the nanostructure layer 500 has rupturedbacteria 501 formed thereon as a result of growth of the bacteria on andaround the nanospikes of the nanostructure layer 500. For example, livebacterial cells have a uniform shape, such as a rod shape or the like.In the embodiment shown, the bacterial membrane has been ruptured by thenanospikes of the nanostructure layer 500, thereby causing the bacterialmembrane to lose its uniform shape and kill the bacterial cells.

FIGS. 6A and 6B provide graphical illustrations demonstratingexperimental performance of a nanostructure layer with respect toreducing bacterial growth under static and rotating conditions inaccordance with various embodiments described herein. The experimentaldata reflected in the graphs of FIGS. 6A and 6B represents an amount ofcolony forming bacterial units present over time on different substrateswith and without nanostructure layers (e.g., nanostructure layer 104 andthe like) under static and rotating conditions. As shown in FIGS. 6A and6B, initial findings suggest that the nanospikes are more effective atkilling bacteria in static mode compared to a sample of nanospikes runat 100 revolutions per minute (rpm). This finding is novel and relevantfor wound dressings, as dressings will often be used in static state.

FIGS. 7A and 7B provide graphical illustrations demonstratingexperimental performance nanostructures layer with different surfaceareas with respect to reducing bacterial growth in accordance withvarious embodiments described herein. The experimental data reflected inthe graphs of FIGS. 7A and 7B represents an amount of colony formingbacterial units over time present on different substrates with differentsurface areas (SA) of nanostructures. As shown in FIGS. 7A and 7B,initial findings suggest that a larger surface area of nanospikes aremore effective at killing bacteria than smaller surface areas. Thisfinding is novel, and can be used to design wound dressings with optimalanti-microbial effectiveness.

FIG. 8 provides a visual flow diagram of an example process 800 forfabricating an antimicrobial bandage apparatus comprising ananostructure layer in accordance with various embodiments describedherein. In one or more embodiments, semiconductor fabrication techniquescan be employed to form the subject nanostructure layers having thegeometric structure described herein at low cost. In this regard, asshown at 802, a silicon wafer can be initially patterned using one ormore low cost semiconductor fabrication techniques to generate a siliconnanospike substrate 801. In one embodiment, the silicon wafer can beetched using metal-assisted chemical etching to generate the siliconnanospike substrate 801. In another embodiment, the silicon wafer can bepatterned using laser interference lithography to generate the siliconnanospike substrate 801. The silicon nanospike substrate comprises aplurality of silicon nanospikes having the desired geometric propertiesof the nanostructures for the nanostructure layer 104. In this regard,the silicon nanospikes can have the same or substantially the same size,shape, pitch and spacing as the nanostructures 106 described withreference to FIG. 2.

The silicon nanospike substrate 801 can then be employed to generate amold 805 having nanopores that correspond to the silicon nanospikes.Using a suitable molding material. For example, the mold material 803can include an epoxy capable of being cured and hardened by ultraviolent(UV) light. Other suitable molding materials can include but are notlimited to: PDMS, PS, polyethylene, polyurethane, polycarbonate, carbonnanotubes, nanowires, nanoparticles, acrylic, epoxy, and hydrogel. Forexample, at 804, the silicon nanospike substrate 801 can be covered witha mold material 803 in a malleable form (e.g., a liquid form, asemiliquid form, a gel form, and the like) such that the mold material803 completely forms on and around the silicon nanospikes. The moldmaterial 803 can further be cured (e.g., by UV light) or otherwisehardened to form a mold 805 which can subsequently be removed from thesilicon nanospike substrate at 806. The resulting mold 805 can comprisenanostructure pores that correspond to the silicon nanospikes of thesilicon nanospike substrate 801.

The mold 805 can further be employed to generate the nanostructure layer104. For example, at 808, a nanostructure layer material 807 in amalleable form (e.g., as an epoxy) can be molded onto the mold 805 (orvice versa), such that the nanostructure layer material 807 fills thenanostructure pores of the mold 805. In one or more embodiments, thenanostructure layer material 807 can comprise an epoxy polymer capableof being cured by UV light. Once the nanostructure layer material 807has filled the nanopores of the mold 805, the nanostructure layermaterial 807 can then be hardened (e.g., via curing with UV light) togenerated the nanostructure layer 104. At 810, the nanostructure layer104 can subsequently be removed from the mold 805. Then at 812, thebandage substrate 102 can be attached to the nanostructure layer 104 (orvice versa) on the side of the nanolayer that is opposite thenanostructures 106.

In other embodiments, various alternative techniques can be employed togenerate a nanospike layer corresponding to the nanospike substrate 801.For example, other techniques for forming the nanostructures can includevarious forms of etching, laser machining, and self-assembly. Furtherthe material employed for a nanostructure layer corresponding to thesilicon nanospike substrate 801 can include but are not limited to:polycarbonate, polyimide, epoxy, metal, glass, cellulose, ceramic, andcomposites. In some embodiments, a nanospike substrate corresponding tothe silicon nanospike substrate 801 can comprise a natural object ormaterial found in nature with similar structure and dimensions as thesilicon nanospike substrate (e.g., such as dimensions similar to thosedescribed with reference to FIG. 2).

FIGS. 9-10 illustrate various methodologies in accordance with thedisclosed subject matter. While, for purposes of simplicity ofexplanation, the methodologies are shown and described as a series ofacts, it is to be understood and appreciated that the disclosed subjectmatter is not limited by the order of acts, as some acts can occur indifferent orders and/or concurrently with other acts from that shown anddescribed herein. For example, those skilled in the art will understandand appreciate that a methodology could alternatively be represented asa series of interrelated states or events, such as in a state diagram.Moreover, not all illustrated acts can be required to implement amethodology in accordance with the disclosed subject matter. Repetitivedescription of like elements employed in respective embodiments isomitted for sake of brevity.

FIG. 9 provides a flow diagram of an example method 900 for generatingan antimicrobial bandage apparatus comprising a nanostructure layer inaccordance with various embodiments described herein.

At 902, silicon wafer is etched to form a plurality of siliconnanostructures. At 904, a nanostructure mold is generated using thesilicon nanostructures, the nanostructure mold comprising a plurality ofnanostructure pores respectively corresponding to the siliconnanostructures. At 906, the nanostructure mold can be applied togenerate a nanostructure film comprising a plurality of nanostructuresrespectively corresponding to the nanostructure pores. At 908, thenanostructure film can be adhered to a surface of a bandage substrate,thereby generating an antibacterial bandage.

FIG. 10 provides a flow diagram of an example method 1000 thatfacilitates wound healing using an antimicrobial bandage apparatus inaccordance with various embodiments described herein.

At 1002, an antimicrobial bandage is adhered to a surface of a bodycomprising a wound, wherein the antimicrobial bandage comprises ananostructure layer comprising a plurality of nanostructures that extendfrom a surface of the antimicrobial bandage, and wherein the adheringcomprises covering the wound with the antimicrobial bandage such thatthe plurality of nanostructures contact the wound. At 1004, bacterialgrowth associated with the wound is reduced as a result of the adhering,thereby facilitating the healing of the wound.

What has been described above includes examples of the embodiments ofthe present invention. It is, of course, not possible to describe everyconceivable combination of components or methodologies for purposes ofdescribing the claimed subject matter, but it is to be appreciated thatmany further combinations and permutations of the subject innovation arepossible. Accordingly, the claimed subject matter is intended to embraceall such alterations, modifications, and variations that fall within thespirit and scope of the appended claims. Moreover, the above descriptionof illustrated embodiments described herein, including what is describedin the Abstract, is not intended to be exhaustive or to limit thedisclosed embodiments to the precise forms disclosed. While specificembodiments and examples are described in this disclosure forillustrative purposes, various modifications are possible that areconsidered within the scope of such embodiments and examples, as thoseskilled in the relevant art can recognize.

In this regard, with respect to any figure or numerical range for agiven characteristic, a figure or a parameter from one range may becombined with another figure or a parameter from a different range forthe same characteristic to generate a numerical range. Other than in theoperating examples, or where otherwise indicated, all numbers, valuesand/or expressions referring to quantities of ingredients, reactionconditions, etc., used in the specification and claims are to beunderstood as modified in all instances by the term “about.”

While there has been illustrated and described what are presentlyconsidered to be example features, it will be understood by thoseskilled in the art that various other modifications may be made, andequivalents may be substituted, without departing from claimed subjectmatter. Additionally, many modifications may be made to adapt aparticular situation to the teachings of claimed subject matter withoutdeparting from the central concept described herein. Therefore, it isintended that claimed subject matter not be limited to the particularexamples disclosed, but that such claimed subject matter may alsoinclude all embodiments falling within the scope of appended claims, andequivalents thereof.

In addition, while a particular feature of the subject innovation mayhave been disclosed with respect to only one of several implementations,such feature may be combined with one or more other features of theother implementations as may be desired and advantageous for any givenor particular application. Furthermore, to the extent that the terms“includes,” “including,” “has,” “contains,” variants thereof, and othersimilar words are used in either the detailed description or the claims,these terms are intended to be inclusive in a manner similar to the term“comprising” as an open transition word without precluding anyadditional or other elements.

Moreover, the words “example” or “exemplary” are used in this disclosureto mean serving as an example, instance, or illustration. Any aspect ordesign described in this disclosure as “exemplary” is not necessarily tobe construed as preferred or advantageous over other aspects or designs.Rather, use of the words “example” or “exemplary” is intended to presentconcepts in a concrete fashion. As used in this application, the term“or” is intended to mean an inclusive “or” rather than an exclusive“or”. That is, unless specified otherwise, or clear from context, “Xemploys A or B” is intended to mean any of the natural inclusivepermutations. That is, if X employs A; X employs B; or X employs both Aand B, then “X employs A or B” is satisfied under any of the foregoinginstances. In addition, the articles “a” and “an” as used in thisapplication and the appended claims should generally be construed tomean “one or more” unless specified otherwise or clear from context tobe directed to a singular form.

What is claimed is:
 1. A method, comprising: etching a silicon wafer toform silicon nanostructures; generating a nanostructure mold using thesilicon nanostructures, the nanostructure mold comprising nanostructurepores respectively corresponding to the silicon nanostructures;employing the nanostructure mold to generate a nanostructure filmcomprising a plurality of nanostructures respectively corresponding tothe nanostructure pores; and adhering the nanostructure film to asurface of a bandage substrate, thereby generating an antibacterialbandage.
 2. The method of claim 1, wherein the bandage substratecomprises a flexible material that can removably attach to a part of abody comprising a wound.
 3. The method of claim 1, wherein thenanostructure film comprises a flexible polymer material.
 4. The methodof claim 1, wherein the etching comprises employing metal-assistedchemical etching.
 5. The method of claim 1, wherein the etchingcomprises employing laser interference lithography.
 6. The method ofclaim 1, wherein the employing the nanostructure mold to generate thenanostructure film comprises: applying a polymer material onto thenanostructure mold and filling the nanostructure pores with the polymermaterial; curing the polymer material after the applying, therebygenerating the nanostructure film; and removing the nanostructure filmfrom the nanostructure mold.
 7. The method of claim 1, wherein thesilicon nanostructures respectively have a pitch between about 100nanometers and about 2.0 micrometers.
 8. The method of claim 1, whereinthe silicon nanostructures respectively have a height between about 100nanometers and about 10.0 micrometers.
 9. An antimicrobial bandage,comprising: a substrate comprising an attachment mechanism thatfacilitates removably attaching the substrate to a part of a bodycomprising a wound; and nanospikes provided on a surface of thesubstrate configured to contact the wound when the substrate is attachedto the part of the body comprising the wound, wherein the nanospikeshave a structure that facilitates reducing bacterial growth associatedwith the wound, thereby facilitating the healing of the wound.
 10. Theantimicrobial bandage of claim 9, wherein the reducing the bacterialgrowth is based on mechanically rupturing bacterial cells by thenanospikes.
 11. The antimicrobial bandage of claim 9, wherein nanospikesrespectively have a pitch between about 100 nanometers and about 2.0micrometers, and a height between about 100 nanometers and about 10.0micrometers.